
3rd International Conference TMM-CH | Call for abstract | Proroga deadline
20-23 Marzo 2023
Eugenides Foundation Athens, Greece
Extended Abstract submission Deadline: 30 ottobre 2022
Informiamo che è stata estesa al 30 ottobre 2022 la deadline per la presentazione degli extended abstract per la 3rd International Conference TMM-CH. Transdisciplinary Multispectral Modelling and Cooperation for the Preservation of Cultural Heritage.
Innovative scientific methodologies and challenging projects marking future trends in the protection of cultural heritage, have initiated a universal conversation within a holistic approach, merging competence from the scientific fields of architecture, civil engineering, surveying engineering, materials science and engineering, information technology and archaeology, as well as heritage professionals on restoration and conservation, stakeholders, industry representatives and policy makers. The combined utilization of digital documentation technologies with innovative analytical and non-destructive techniques, numerical, computational and 3D techniques, archaeometric and archaeogene methods, supports the creation of a transdisciplinary multispectral modeling towards the sustainable preservation of cultural heritage. Innovation is enhancing and revealing a critical dimension of the preservation of cultural heritage along with social participation and communication, and supporting peace through culture.
The National Technical University of Athens interdisciplinary team “Protection of monuments” [Prof. A. Moropoulou, Prof. M. Korres, Prof. A. Georgopoulos, Prof. C. Spyrakos, Ass. Prof. C. Mouzakis], scientific responsible for the Holy Aedicule’s rehabilitation of the Holy Sepulchre in Jerusalem, and the Technical Chamber of Greece, in collaboration with international and Greek Organisations and Universities, organize the 3rd TMM_CH International Conference on “Transdisciplinary Multispectral Modelling and Cooperation for the Preservation of Cultural Heritage: Recapturing the World in Conflict through Culture, promoting mutual understanding and Peace”, on 20-23 March 2023 in Athens, Greece, discussing modern trends in the original agora of our technological and democratic roots.
The Conference is organized by the National Technical University of Athens in cooperation with the Technical Chamber of Greece, under the patronage of H.E. the President of the Hellenic Republic, Ms Katerina Sakellaropoulou, with benedictions bestowed by His All Holiness, Ecumenical Patriarch, Bartholomew I of Constantinople, and His Beatitude Archbishop Hieronymus II of Athens and All Greece.
Distinguished scientists and representatives of the National Geographic Society, the Cultural Heritage Finance Alliance, the International Council of Monuments and Sites ICOMOS, the Organization of World Heritage Cities OWHC, the European Society for Engineering Education SEFI, the European Construction Technology Platform ECTP, the International Federation of Surveyors FIG, the International Committee CIPA Heritage Documentation, the World Monuments Fund, AHEPA Hellas and other major International and European Organizations, Associations, networks Universities and Research Centers in the field of cultural heritage preservation, participate in the International Steering and Scientific Committees which had successfully organized the 1st and 2nd TMM_CH Conferences.
The conference will be held at the Eugenides Foundation. On-site attendance and oral presentation is required and will be organised according to government restrictions against Covid-19. Scientific walk and talk visits on 23 March 2023 to Acropolis Museum [in the footsteps of the Greek Peripatetic Philosophical School] and other visits planned upon demand.
At the 1st and the 2nd TMM_CH Conferences, which were held with great success in October 2018 and December 2021 respectively at the Eugenides Foundation in Athens, with the presence of 350/650 delegates from 22/33 countries from all continents, and over five thousand viewers the emblematic rehabilitation of the Holy Aedicule of the Holy Sepulchre in Jerusalem was presented as an exemplary application, in the field of monuments’ protection, of interdisciplinary and multispectral collaboration, as an outcome of innovation, not only on Research, but in the implementation process as well, with emphasis on technological advancements, not only intersecting all the scientific fields of engineers and natural scientists, but also initiating an ongoing dialogue with humanities, such as Archaeology, Theology, Sociology, Diplomacy and Tourism. Innovative knowledge transfer through practice and education is continuing the venture for the rehabilitation projects in the Holy Sepulchre Church, adjoining the National Technical University of Athens and La Sapienza University of Rome with Bezalel Academy of Science and Arts in Jerusalem, in cooperation with Israeli Antiquities Authority, through the Erasmus+ Strategic Alliance EDICULA “Educational Digital Innovative Cultural Heritage related Learning Alliance”.
Further to the achievements of the 2nd TMM_CH Conference the latest developments in research and innovation that identify novel trends to build an interdisciplinary approach to conservation and holistic digital documentation of cultural heritage is attempted at the 3rd TMM_CH. The utilization and reuse of monuments, historic cities and sites, forms the framework of a sustainable preservation of cultural heritage, in accordance with the principles of circular economy; in terms of respect and protection of values, materials, structures, architecture and landscape; with an informed society, able to participate effectively in the policies that will design and implement the new strategies required.
Sharing knowledge, experiences, and recommendations about sustainable cultural heritage approaches and practices at a moment of great conflicts and climate change, energy, environment and socio-economic risks, the sustainable preservation of cultural heritage is addressing challenges through mutual understanding and international cooperation.
Per saperne di più: https://tmm-ch.com/#about
Scarica il testo completo della Call: TMM_CH2023_Call_for_Papers
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